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Rogers RO4350B High-frequency Laminate 0.338 mm 13.3mil Immersion Gold Circuit Board

Shipped: 30th-DEC-2024  

1. Introduction of RO4350B

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics, offering electrical performance similar to PTFE/woven glass while maintaining the manufacturability of epoxy/glass.


 
These laminates ensure tight control over dielectric constant (Dk) and low loss using standard epoxy/glass processing methods. Available at a fraction of the cost of traditional microwave laminates, RO4350B does not require special through-hole treatments like PTFE-based materials. They are UL 94 V-0 rated for active devices and high-power RF designs.
 
The thermal coefficient of expansion (CTE) of RO4350B closely matches that of copper, providing excellent dimensional stability essential for mixed-dielectric multilayer boards. Its low Z-axis CTE ensures reliable plated through-hole quality, even under severe thermal shock. With a Tg exceeding 280°C (536°F), RO4350B maintains stable expansion characteristics across the circuit processing temperature range.
 

2. Features

- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C

- Dissipation Factor of 0.0037 at 10GHz/23°C

- Thermal Conductivity 0.69 W/m/°K

- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C

- High Tg value of >280 °C

- Low water absorption of 0.06%

 

3. Benefits

-Perfect for multi-layer board (MLB) constructions

-Processes similar to FR-4 at reduced fabrication costs

-Outstanding dimensional stability

-Cost-effective

 

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO4350B Core - 0.338 mm (13.3mil)

Copper_layer_2 - 35 μm

 
5. PCB Construction Details:
 

- Board dimensions: 40 mm x 40 mm=1PCS, +/- 0.15mm

- Minimum Trace/Space: 5/6 mils

- Minimum Hole Size: 0.2mm

- No Blind vias.

- Finished board thickness: 0.5mm

- Finished Cu weight: 1oz (1.4 mils) outer layers

- Via plating thickness: 20 μm

- Surface finish: Immersion Gold

- Top Silkscreen: White

- Bottom Silkscreen: No

- Top Solder Mask: No

- Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 
 
 

6. PCB Statistics:
Components: 10

Total Pads: 29

Thru Hole Pads: 19

Top SMT Pads: 10

Bottom SMT Pads: 0

Vias: 21

Nets: 1

 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide

10. Some Typical Applications:
- Antennas and power amplifiers for cellular base stations

- RF identification devices

- Radar and sensor systems for automotive applications

- LNB converters for direct broadcast satellites

 
 
 
 
 
 
NEXT:RO4535 PCB 20mil Rogers 2-layer Substrates High Frequency Laminate for Microstrip Antennas
 
 
 

 

 
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